Alloy Thin Films by Multi-Target Sputtering Overview Application of Thin Films Research Project Processing
Billera, Renee, Coordinating Producer has reference to this Academic Journal, PHwiki organized this Journal Alloy Thin Films by Multi-Target Sputtering Karla L. Perez MSE/REU Final Presentation Adv. Prof. King in addition to Prof. Dayan in addition to a August 5, 2004 Overview Introduction Research Project Processing Measuring Film Thickness Optical Microscope AFM Alloy Thin Film Deposition Composition Conclusion Application of Thin Films Antireflection coatings as long as camera lenses Optical filters as long as communication Decorative coatings on plastics Silicon chips Metallic coatings To provide insulating layers between conductors
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Research Project The main goal is to create alloy thin films with uni as long as m composition in addition to thickness Study the compositions of pure metal thin films in addition to their thickness Pure metal components to be used: Ag, Cu, Ta, Mo, Ni, Fe, Ti Design a system which will enable us to manage the composition in addition to geometry of the alloy thin films Processing Sputtering It is a type of Physical Vapor Deposition. It is carried out at high vacuum in a chamber connected to a high voltage DC supply. Argon gas is pumped into the chamber in addition to creates argon plasma. The Argon plasma is directed to the target in addition to its atoms are vaporized. The vaporized material is then deposited on the substrate. Measuring Film Thickness Optical Microscope Differential Interference Contrast (DIC) Ag 20min 4cm
Measuring Film Thickness Optical Microscope Cu 10min 4cm Ag 20min 4cm Measuring Film Thickness Optical Microscope Ag 10 min 4cm Ag 20min 4cm Measuring Film Thickness Atomic Force Microscope (AFM) Tapping mode: Measures the topography by tapping the surface with an oscillating tip. This eliminates the shear as long as ces which can damage soft samples in addition to reduce image resolution.
Measuring Film Thickness Measuring Film Thickness AFM Ag 20min 2cm
Measuring Film Thickness AFM Mo 30min 2cm Measuring Film Thickness AFM Cu 30min 2cm
Ag 30min 2cm 14.19 52.40 Alloy Thin Film Deposition Deposit alloy thin films using a sputter coater with a Copper-Silver target
Composition of Ag-Cu Thin Film 92.7% 7.3% 50.3% Position on slide Composition of Ag-Cu Thin Film 95.6% 4.4% 50.3% Position on slide Conclusion The thickness of the film varies according to their position relative to the target. Films deposited are thicker in the middle. Deposited one alloy thin film The same composition gradients of silver in addition to copper do not occur in the middle of the film.
Acknowledgements Prof. King Prof. Dayan in addition to a Prof. Kvam NSF Grant Questions Thank you!!!
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