Mission Profile Aware IC Design – A Case Study – Overview Introduction

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Mission Profile Aware IC Design – A Case Study – Overview Introduction

Booker, John, Host has reference to this Academic Journal, PHwiki organized this Journal Mission Profile Aware IC Design – A Case Study -Goeran Jerke, Robert Bosch GmbH, Automotive ElectronicsAndrew B. Kahng, University of Cali as long as nia, San DiegoThis research project is supported by the German Government, Federal Ministry of Education in addition to Research under the grant number 16M3195CIntroductionDesign ChallengesMission Profile Aware DesignCase Study – Electromigration Aware IC DesignSummary in addition to ConclusionOverview25-Mar-141Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoIntroduction25-Mar-1425-Mar-14ECUs, mechatronicssensorsMEMS sensorsSemiconductorsOEMTier 1Tier 2OEM – Original Equipment Manufacturer

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Introduction25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego3Introduction25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego4Electronic Control Unit as long as ESPIntroduction25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego5Tier 2 +Tier 1ECU as long as Driver AssistanceAcceleration Sensor Module

Introduction25-Mar-146Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoEnvironmentOEMTier 1, OEMTier 1Tiers 1 in addition to 2FoundryTier 2FoundrySystem Design Packaging ConstraintsFunctional LoadConstraintsTemperaturesResponsibilityParametersAmbient Temperature (Car)Installation Location (Car)ECU HousingECU (internal)Component PinDevice JunctionIC Technology Node EvolutionIntroduction25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego7Smart-PowerHV-CMOSCMOS automotiveCMOS leading edge (ITRS)Aggressive technology scalingTime to market co-designSystem partitioning in addition to integrationRobustnessApplication requirements:Origin in addition to cause of requirements replicability, qualityImpact on application design in addition to technologiesApplication use operating conditions, environmental loadFunctional loads thermal, current, voltage, Reliability dominant failure mechanismsComplex, heterogeneous in addition to fragmented design flowsDesign Challenges25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego8

Aggressive technology scalingTime to market co-designSystem partitioning in addition to integrationRobustnessApplication requirements:Origin in addition to cause of requirements replicability, qualityImpact on application design in addition to technologiesApplication use operating conditions, environmental loadFunctional loads thermal, current, voltage, Reliability dominant failure mechanismsComplex, heterogeneous in addition to fragmented design flowsDesign Challenges25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego9IntroductionDesign ChallengesMission Profile Aware DesignCase Study – Electromigration Aware IC DesignSummary in addition to ConclusionOverview25-Mar-1410Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego11 OEMTier 1Tier 2 Tier nSupply Chain

Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego12 OEMTier 1Tier 2 Tier nDesign ChainMPMPMPMPMPMPMPMPRequirements, Constraints, Functional Loads, Environmental LoadsMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego13 OEMTier 1Tier 2 Tier nDesign ChainMPMPMPMPMPMPMPMPNEW: Achieved Robustness, Dominant Failure Mechanisms RIFDesign Flow OverviewMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego141233544

Consistent consideration of mission profiles (MP) in supply chain Reduction of design uncertainty More precise requirements in addition to stress factors Better underst in addition to ing of system (failure mechanisms) Formalized in addition to improved communication OEM Tier n in addition to Tier n OEMSt in addition to ardization of structure in addition to content of MPsElectronic as long as mat MP documents RMP Framework (Tool-independent plat as long as m as long as mission profile aware design)Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego15Mission Profile DocumentDocument headerOperating states definitionComponent definitionProperty definitionBack-annotation dataMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego16Mission Profile DocumentDocument headerAuthorTimestampDocument historyMounting locationOperating states definitionComponent definitionProperty definitionBack-annotation dataMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego17

Mission Profile DocumentDocument headerOperating states definitionGeneric data container as long as operating states Manufacturing, assembly, storage, Car: start, acceleration, breaking, stop&go, freeway cruising, IC: power-up, idling, power-down, mode-1, mode-2, Component definitionProperty definitionBack-annotation dataMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego18Mission Profile DocumentDocument headerOperating states definitionComponent definitionType e.g. ECU, passive component, IC, sensor, Device I/O port definition ()Operating state dependent environmental in addition to functional loadsHeat flowTransient/effective voltages in addition to currents ProfilesProperty definitionBack-annotation dataMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego19() A port is a generic object: thermal port or electrical port Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego20Source: ZVEI H in addition to book RV EE Modules 2012

Mission Profile DocumentDocument headerOperating states definitionComponent definitionType Device I/O port definitionProfiles:Temperature histogram, gradient in addition to cyclingHumidity vs. temperature histogramVibration Property definitionBack-annotation dataMission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego21Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego22Source: ZVEI H in addition to book RV EE Modules 2012Mission Profile DocumentDocument headerOperating states definitionComponent definitionProperty definitionBack-annotation dataReliability: Robustness Indication Figures (RIF) of dominant failure mechanismsRobustness: Enhanced Worst-Case Distance (WCD)Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego23

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Mission Profile Aware Design25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego24Component ParameterECU TEEM-Package, TVMLA, TEEM-internal , TComp.Package , Board TBoard , Package TComp.Package, TComp.Pins, Rth, Chip TJunction, SensorDiscrete device, Source: ZVEI H in addition to book RV EE Modules 2012Component PropertiesIntroductionMission Profile Aware DesignCase Study – Electromigration Aware IC DesignSummary in addition to ConclusionOverview25-Mar-1425Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoQuality of Functional Load DataEM Aware Design – Case Study25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego26Classic Design Flow

EM Aware Design – Case Study25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego27Current Aware Design FlowCell-LevelEM Aware Design – Case Study25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego28Current Aware Design FlowBlock-LevelEM Aware Design – Case Study25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego29I = 1A DC AE/QMMElectrical Overstress (EOS)VoidsVoidsHillockHillockElectromigration (EM)AE/QMMImax = 1A + Duty cycleIIttAbnormal peak eventEMEOS RPP EM EOS RPP AE/QMMRepetitive Power Pulsing (RPP)Quality of Functional Load Data

IntroductionDesign ChallengesMission Profile Aware DesignCase Study – Electromigration Aware IC DesignSummary in addition to ConclusionOverview25-Mar-1436Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoConsideration of robustness as design target is essential as long as automotive electronic designsConsistent consideration of mission profiles within the design chain is required (bi-directional flow)Current aware design is driven by mission profiles Mission profile aware design:Vendor- in addition to EDA tool-independent focus on design flow Reduction of design uncertaintyFormalized in addition to improved communicationSummary in addition to Conclusion25-Mar-14Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San Diego3725-Mar-1438Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of Cali as long as nia, San DiegoThank You!

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