Testing of MEMS Materials Using Thermal Actuation, AFM Image Correlation in addition to Cap

Testing of MEMS Materials Using Thermal Actuation, AFM Image Correlation in addition to Cap www.phwiki.com

Testing of MEMS Materials Using Thermal Actuation, AFM Image Correlation in addition to Cap

Roizen, Ezra, Contributing Editor has reference to this Academic Journal, PHwiki organized this Journal Testing of MEMS Materials Using Thermal Actuation, AFM Image Correlation in addition to Capacitance Measurement Students: Y. Chen, B. Peng, in addition to Z. He Mentor: Y. Zhu March 20, 2003 Introduction The reliability of MEMS devices is a major issue in addition to it can only be addressed by direct measurements on small specimens with dimensions on the same order of magnitude as the fabricated micro-devices Knowledge on bulk material behavior fails to describe material response in this size regime Various techniques have been developed in the past to address the issues of mechanical integrity in addition to evaluation of the elastic properties of polysilicon. Tensile tests are less vulnerable to geometry-induced errors in addition to the measurements are easier to interpret from an error analysis point of view Experimental setup Three components: Thermal actuator , specimen, load sensor Scheme of the MEMS tensile testing device

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AFM image shows the surface roughness in addition to grain size of the specimen Optical image of the microtensile specimen in addition to the MEMS testing device. 1 micron Experiment Step 1: Characterize the system error by scanning the same area at zero loading to eliminate the results of the shifting in addition to minimize the measuring error Step2: Using AFM records of de as long as med in addition to unde as long as med specimen configurations to measure the strains of the surface of the specimen Step 1. Scanning the same area without load Two AFM images of the unde as long as med specimen surface. The images are scanned at the same location with a frequency of 2 Hz. The scanning area is 5×5 mm2 . It is very hard to find the difference of the two images by naked eyes.

Analyze the displacement by DIC method (1) exx = 0.000521, eyy = -0.0484 Analyze the displacement by DIC method (2) exx = 0.000569, eyy = -0.0509 Analyze the displacement by DIC method (1) exx = 0.000518, eyy = -0.0533

(a) Strain of unde as long as med specimen at x direction (b) Strain of unde as long as med specimen at y direction (c) Strain of de as long as med specimen at x direction (d) Strain of de as long as med specimen at y direction X Y 1 mm Step 2: DIC results of strain analysis on both unde as long as med in addition to de as long as med specimen. The four images are at the same location. X is the direction of the load. Calculated Strain: Simulation

Conclusion The absence of surface developed charges makes the use of a probe microscope possible in the regime of small interaction as long as ces between the film in addition to the AFM probe. This technique is less vulnerable to geometry-induced errors in addition to the measurements are easier to interpret from an error analysis point of view. Although there is an initial drifting of the AFM image at zero load, the strain of the specimen can be compensated by subtract the measured strain by the initial shifting Future work will be conducting measurements at various voltages (loads) to find the sensitivity of the strain measurement.

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Roizen, Ezra Contributing Editor

Roizen, Ezra is from United States and they belong to AlwaysOn Magazine and they are from  San Francisco, United States got related to this Particular Journal. and Roizen, Ezra deal with the subjects like Biotechnology; Business; Financial; Investing; New Media

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